Spectrum Microwave, an RF & Microwave Components and Systems Businesss Spectrum Microwave welcomes Sage Laboratories to the combined talents of Amplifonix, Q-Bit, EMF, Magnum, Radian, FSY, and Salisbury Engineering in one world class organization
Spectrum Microwave
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  Build To Print | Automated Die Attach
 
High volume pick & place production reaching 6,000 die per hour In-house Thin Film Fabrication Precision Die Bonding Automated Millimeter-Wave Testing Millimeter Wave Assembly In-House Laser Sealing Fluxless "Void-Free" Soldering Precision Wire Bonding Glob-Top Epoxy Dispensing Precision Automatic Aluminum Wedge Bonding
IntroductionDie BondingWirebondingFluxless SolderDie/MMIC AttachAutomated PCB AssemblyAutomated Element AttachEpoxy "Glob top" DispensingAqueous CleaningTestingSealingIn-House Thin Film FabricationQuality Assurance
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Automated Die Attach
  • Dual GSM1 4-Head stations allow high volume pick and place production reaching 6,000 die per hour.
  • Precision placement repeatable to ±10 microns.
  • Able to dispense a wide variety of materials including GaAs bare die, Micro-BGA, and optical components.

Automated Die Attach

Spectrum Microwave’s automated die attach capabilities focus on the same high quality process control that our ISO 9001:2000 certification demands. Our reputation in the hybrid market is well deserved, as both large and small projects are given the same high quality customer service that made Spectrum Microwave a leader in this industry.

  • Accuracy 3 Sigma to 10 micron
  • Die Placement Rate to 3000/ Hour
  • Chip Placement Rate to 8000/Hour
  • Flip Chip Capability
  • Direct CAD Programming
Universal GSM Platform

Universal GSM platform provides accuracy to +/- 10 microns. Our application experience covers state-of-the-art microelectronic technologies including GaAs bare die, micro BGA, and optics.