A high degree of accuracy is achieved using split monitors to view both the pick-up and bonding stages simultaneously. The die pickup system is geared to handle extremely fragile die including those made of GaAs or InP.

Manual Die Bonding & MMIC Attachment

One of Spectrum Microwave's strengths is the wide assortment of options they offer their customers. From large pick and place orders, down to small run precision die bonding, they are geared for versatility with precision in mind.

Spectrum utilizes high precision Ultron bonders which offer consistent placement and accuracy of 0.001". These systems can die bond to a wide assortment of packages and substrates.