Spectrum Microwave, an RF & Microwave Components and Systems Businesss Spectrum Microwave welcomes Sage Laboratories to the combined talents of Amplifonix, Q-Bit, EMF, Magnum, Radian, FSY, and Salisbury Engineering in one world class organization
Spectrum Microwave
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  Build To Print | Manual Die Bonding & MMIC Attachment
 
High volume pick & place production reaching 6,000 die per hour In-house Thin Film Fabrication Precision Die Bonding Automated Millimeter-Wave Testing Millimeter Wave Assembly In-House Laser Sealing Fluxless "Void-Free" Soldering Precision Wire Bonding Glob-Top Epoxy Dispensing Precision Automatic Aluminum Wedge Bonding
IntroductionDie BondingWirebondingFluxless SolderDie/MMIC AttachAutomated PCB AssemblyAutomated Element AttachEpoxy "Glob top" DispensingAqueous CleaningTestingSealingIn-House Thin Film FabricationQuality Assurance
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Flux-Free Soldering
  • Low Temperature (280°C) Eutectic die attach methods also used for maximum diffusion involving 80Au 20Sn alloys.
  • Solder attach methods include: 98Au, 2Si, Sn96, Sn98, SAC 305 (RoHS)
  • High Frequency bonding from DC to 50 GHz

Complex Millimeter-wave MMIC Attachment

Precision Millimeter-wave bonding techniques are essential, especially in Q-band applications. Spectrum Microwave's void-free process maintains maximum die-to-substrate surface contact eliminating poor signal propagation found in less sophisticated semiconductor or MMIC die attachment methods.

  • Eutectic
    • 80Au, 20Sn
  • Solder
    • 98Au, 2Si
    • Sn 96
    • Sn 98
    • SAC 305 (RoHs)
  • Epoxy
    • 841LMI conductive past
    • 570K non-conductive film
    • 5025E conductive film
    • 968-4 non-conductive paste
  • MMIC assembly (GaAs)
  • Precision placement +/- 10u