Spectrum Microwave, an RF & Microwave Components and Systems Businesss Spectrum Microwave welcomes Sage Laboratories to the combined talents of Amplifonix, Q-Bit, EMF, Magnum, Radian, FSY, and Salisbury Engineering in one world class organization
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  Build To Print | Epoxy Dispensing “Glob-top”
 
High volume pick & place production reaching 6,000 die per hour In-house Thin Film Fabrication Precision Die Bonding Automated Millimeter-Wave Testing Millimeter Wave Assembly In-House Laser Sealing Fluxless "Void-Free" Soldering Precision Wire Bonding Glob-Top Epoxy Dispensing Precision Automatic Aluminum Wedge Bonding
IntroductionDie BondingWirebondingFluxless SolderDie/MMIC AttachAutomated PCB AssemblyAutomated Element AttachEpoxy "Glob top" DispensingAqueous CleaningTestingSealingIn-House Thin Film FabricationQuality Assurance
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Thin Film

Epoxy Dispensing “Glob-Top”

Primary Encapsulation or Glob Top is a technique where a specific amount of resin is deposited over an open chip and its wire bonds. These high performance resins provide mechanical support, while protecting wires and bonds from corrosive residues and contaminants.

  • High Accuracy +/- .0005"
  • Dual Head
  • 2000 Glob Tops/hr