Fluxless Void-free Soldering

Flux use removes oxides from the substrate and inhibits further oxidation insuring both intimate substrate-to-alloy contact and a secure bond. Spectrum Microwave offers flux-free soldering for the fabrication of precision void free solder joints. Flux-free soldering provides a lower thermal path, enhanced reliability, and the lowest resistance RF ground performance.

Spectrum Microwave's Programmable Vacuum/Pressure furnaces enable this repeatable flux-free soldering through precise automatically controlled heating to levels of 500°C, inert gas environments at pressures up to 50 psig or vacuum levels down to 50 millitorr, and regulated cooling rates.

Spectrum Microwave's DAP flux-free soldering provides a consistent and even distribution of soldering thus eliminating voids which can cause poor grounding leading to parasitics and signal degradation, especially at higher frequencies.

SST DAP-2200 Reflow System

• Void Free Solder Capabilities
• Fluxless Processing
• High power Applications
• Millimeter Wave RF Applications