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Novel Techniques
Flux use removes oxides from the substrate and inhibits further oxidation insuring both intimate substrate-to-alloy contact and a secure bond.
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Novel Techniques
Flux use removes oxides from the substrate and inhibits further oxidation insuring both intimate substrate-to-alloy contact and a secure bond.
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Void Free Solder Joints
Spectrum Microwave offers flux-free soldering for the fabrication of precision void free solder joints.
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Enhanced Reliability
Flux-free soldering provides a lower thermal path, enhanced reliability, and the lowest resistance RF ground performance.
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Precision Engineering
Our programmable vacuum/pressure furnaces enable this repeatable flux-free soldering through precise, automatically controlled heating to levels of 500°C, inert gas environments at pressures up to 50 psig or vacuum levels down to 50 millitorr, and regulated cooling rates.
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Superior Bonding
Spectrum Microwave's DAP flux-free soldering provides a consistent and even distribution of soldering.
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Extraordinary Processes
Our flux-free soldering process eliminates voids which can cause poor grounding leading to parasitics and signal degradation, especially at higher frequencies.
