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Glob Top Techniques
Primary Encapsulation, or Glob Top, is a technique where a specific amount of resin is deposited over an open chip and its wire bonds.
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Glob Top Techniques
Primary Encapsulation, or Glob Top, is a technique where a specific amount of resin is deposited over an open chip and its wire bonds.
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High Performance
These high performance resins provide mechanical support, while protecting wires and bonds from corrosive residues and contaminants.
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Attention To Detail
The value added production service of epoxy dispensing boasts features including: high accuracy +/- .0005", dual head, and 2000 glob tops per hr.
