Spectrum Microwave, an RF & Microwave Components and Systems Businesss Spectrum Microwave, the combined talents of Amplifonix, Q-Bit, EMF, Magnum, Radian, FSY, and Salisbury Engineering in one world class organization
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Testing and Verification Testing and Verification Capabilities

Integral to finding solutions to frequency control problems is the ability to test for compliance. In order to successfully test these complex designs, we have invested heavily in high-performance test equipment including Agilent PNA network analyzers with calibrated performance to 50 GHz, low-phase noise signal generators, an Agilent ES5500 phase noise measurement system, and additional in-house environmental test equipment.

Using this equipment, we have measured the vibration-induced phase noise modulation performance of systems and components employing narrow-band filtering. Our ability to conduct such a wide range of tests in-house allows for a faster turnaround of your complete design solution.
Unique In-House Testing Capabilities Unique In-House Testing Capabilities
  • S-Parameter testing
  • Phase Noise testing
  • AM Noise testing
  • Pulsed RF Measurements
  • Noise Figure testing
  • MIL-PRF-38534 Class H
  • ESS - Environmental Stress Screening
  • Analytical circuit design
  • Surge testing and power handling
  • EN testing for European requirements
  • All screening performed on-site
  • All group testing performed on-site
 
MIL-STD-883 Group A
Test MIL-STD-883
Description Method Condition In House
Salt Spray 1001 -  
Moisture Resistance 1002 II  
Mechanical Shock 2004 -
Barometric Pressure 3001 -
Internal Visual 2017 -
Stabilization Bake 1008 24 hrs @ 150°C
Temperature Cycle 1010 -65°C to 150°C
Constant Acceleration 2001 5000 G y1
Hermetic Seal (Fine & Gross) 1014 A and C
Burn In 1015 168 hrs @ 85°C
External Visual 2009 -
Steady State Life 108 D
 
MIL-STD-202 Group B
Test MIL-STD-202
Description Method Condition
Vibration 204 G
Thermal Shock 107 A-1
Salt Spray 1009 A
Moisture Resistance 106 -
Mechanical Shock 213 I
Barometric Pressure 105 C
Resistance to Solder Heat 210 B
Lead Integrity 2004 B2
 
MIL-PRF-38534F Group C
Test Method Conditions (PI)
External Visual 2009  
PIND 2020  
Temperature Cycling 1010 C, 20 Cycles
Temperature Cycling 1010 C, 10 Cycles
Mechanical Shock 2002 B, Y1 Direction or 3000 g's, Y1 Direction
Seal (Fine and Gross) 1014  
Visual Examination 1010  
Endpoint Electrical *  
Steady state life 1005 1000 hours at 125°C or equivalent (1005)
Endpoint Electrical *  
Internal Water Vapor 1018  
Internal Visual and Mechanical 2014  
Wire bond strength 2011  
Element Shear 2019  
ESD 3015  
 
* in accordance with the applicable device specification
 
MIL-PRF-38534F Group D
Description Method Condition (PI)
Thermal Shock 1011 C
Stabilization Bake 1008 150°C, 1 Hour
Lead Integrity 2004 B2
Seal (Fine and Gross) 1014 A, D
Salt Atmosphere 1009 A, D
Metal Package Isolation 1003 600 V DC , 100 nA Max.
 
MIL-PRF-38534F Class K
Test Method Conditions (PI)
Preseal Burn-in 1030  
Non-Destructive Bond Pull 2023  
Internal Visual 2017  
Temperature Cycling 1010 C, 10 Cycles
Mechanical Shock or
Constant Acceleration		 2002/2001 B, (Y1 Direction) 3000 g's, Y1 Direction only
PIND 2020 Condition A shall be used for Class K,
unless otherwise specified.
Pre Burn-in Electrical *  
Burn-in 1015  
Final Electrical Test *  
Seal (Fine and Gross) 1014  
Radiographic** 2012  
External Visual 2009  
 
* in accordance with the applicable device specification
** Will be designed to meet requirements, but Radiographic Test Results not included.