Spectrum Microwave, an RF & Microwave Components and Systems Businesss Spectrum Microwave welcomes Sage Laboratories to the combined talents of Amplifonix, Q-Bit, EMF, Magnum, Radian, FSY, and Salisbury Engineering in one world class organization
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  Thin Film | Plated Through Vias
 
Available substrate materials include: BeO, Alumina, Aluminum Nitride, Silicon and Ferrites ISO 9001:2000 with IPC 610 certified operators and processes Polyimide, Silox and Silicon Nitride Dielectrics Gold Wrap-around Technology Gold plated Vias Polyimide, when added traditionally, allows for repeatable coupler lines & spaces as small as 0.0006" Tolerances to ± 0.00005" (1.27µm) Fine lines and spaces 0.0004"/0.0004" (10µm)
Metallization Design Guidelines Plated Through Vias TaN & NiChrome Resistors Polyimide Bridges & Dams
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NiChrome/Tantalum Nitride Resistors
Edge and Via Wrap-Around Services with Selective 360° Deposition

Few companies have the capability to provide edge and via wrap-around services as Spectrum Microwave does. Selective 360° deposition allows for Gold to be deposited with a thickness of 100-400 micro inches.

Edge and Via Wrap-Around Services with Selective 360° Deposition

Metal schemes including Gold, Copper, Nickel, Nichrome, and Tantalum Nitride lines/spaces to ±0.000050".

Edge and Via Wrap-Around Services with Selective 360° Deposition

BeO, Alumina, Aluminum Nitride, Silicon and Ferrites are just some of the substrate materials available.

Edge and Via Wrap-Around Services with Selective 360° Deposition

Gold plated or metallized vias for improved ground plane connection or heat dissipation.

Whether drilling on Alumina, Aluminum Nitride, BeO, Silica or Quarz, using Spectrum Microwave's advanced laser drilling method ensures enhanced mounting convenience without the need for ackward bonding techniques.

Vias

Spectrum Microwave offers both filled vias or plated through holes, part of the benefits of the Spectrum Microwave Advantage. Our in-house laser drilling capabilities allow you, the customer, to eliminate epoxy bonding in the assembly process for improved grounding and thermal conductivity.