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Automatic Wirebonding
Part of our core of expertise is the versatility of both automated Wirebonding and manual bonding systems that make up the foundation of our service.
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Automated Wirebonding
Part of our core of expertise is the versatility of both auto-bonding and manual bonding systems that make up the foundation of our service.
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Versatile Abilities
Our Wirebonding abilities range from Automatic Gold Ball Bonding, which can handle wires from 1-3 mils, to Automatic Aluminum Wedge Bonding, which can likewise handle wires from 1-20 mils.
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Manual Wirebonding
Spectrum Microwave also specializes in manual wirebonding using dependable wire ribbon techniques which other companies fail to include in their line-up.
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Diverse Capabilities
Spectrum Microwave Wirebonding capabilities: automatic 1-3 mil gold ball bonding, automatic 1-3 mil aluminum wedge bonding, automatic 5-20 mil aluminum wedge bonding, manual bonders (ribbon and wire), 123,000 interconnects per shift, 2-3 wire per second, 5” x 12” table travel.
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Customizable Options
We also have constant wire length capability for controlled inductance bonds.
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Simulation & Design
Spectrum Microwave’s engineers can often simulate the outcome of the proposed design, optimizing certain characteristics while reducing lead time and production costs.
State of the art tools such as Agilent ADS, Agilent Genesys, Cadence Allegro, SolidWorks, AutoCAD, and Sonnet Professional EM Simulator guide decision making processes.
